Phenolic molding materials and processes

Details Phenolic molding materials and processes Phenolic molding materials and processes

1985-10-04

1988-11-15

Jacobs, Lewis T.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

524451, 524594, 524789, 524790, 524876, C08K 716, C08K 334

Patent

active

047850400

ABSTRACT:
Novel phenolic molding compositions comprise (1) a resole phenolic resin, (2) an alkaline earth metal hydroxide or oxide, and/or a silane compound, and (3) a mixture of clay and talc fillers and/or microballoons. The composition also generally contains a mold release agent, and a silane coupling agent. The alkaline earth metal hydroxide or oxide is preferably calcium and/or magnesium hydroxide or oxide. A mixture of the calcium and magnesium compounds is most preferred. The foregoing molding compositions are applied to glass fibers or filaments to provide compositions useful in sheet molding compound processes, pultrusion processes, filament winding, and continuous laminating processes, as well as in ram injection molding and transfer molding.

REFERENCES:
patent: 2424787 (1947-07-01), Adams
patent: 3422784 (1966-04-01), Boggs
patent: 3988289 (1976-10-01), Clark et al.
patent: 4067829 (1978-01-01), Garrett
patent: 4075155 (1978-02-01), Philipps
patent: 4116921 (1978-09-01), Olivo et al.
patent: 4182701 (1980-01-01), Cottrell et al.
patent: 4210562 (1980-07-01), McCombs
patent: 4403066 (1983-09-01), Brode et al.
patent: 4419400 (1983-12-01), Hindersinn

Affiliated with

Also associated with

Rating

Phenolic molding materials and processes does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Phenolic molding materials and processes, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Phenolic molding materials and processes will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1104082