Phase mask for projection lithography and method for the manufac

Radiation imagery chemistry: process – composition – or product th – Radiation modifying product or process of making – Radiation mask

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430321, 430323, 430324, G03F 900

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053976649

ABSTRACT:
A carrier of light-transmissive material has a mask pattern of light-absorbent material arranged thereon. The carrier comprises first regions and second regions that are not covered by the absorbent material. An optical thickness of the carrier in the first regions differs from an optical thickness in the second regions such that a phase difference of 180.degree..+-.60.degree. exists between light that has traversed the first regions and light that has traversed the second regions. For manufacturing the phase mask, the first regions are produced by isotropic etching of the light-absorbent material and the second regions are produced by anisotropic etching into the carrier.

REFERENCES:
patent: 5045417 (1991-09-01), Okamoto
Patent Abstracts of Japan, JA 0211451, Aug., 1990, Akihiro Nitayama, "Exposure Mask, Manufacture of Exposure Mask, and Exposing Method Using the Same".
IEEE Transactions on Electron Devices, vol. ED-29, No. 12, Dec., 1982, "Improving a Resolution in Photolithography with a Phase-Shifting Mask", by Marc D. Levenson et al, pp. 1828-1836.
SPIE vol. 470, Optical Microlithography III, Technology for the Next Decade (1984) "Optical Imaging with Phase Shift Masks", by Mark D. Prouty et al, pp. 228-232.
"Photomask", by Tsuneo Terasawa, No. 60-134138, vol. 11, No. 162; (P-579) (1609) May 26, 1987.
SPIE, vol. 1088 Optical/Laser Microlithography II (1989), "0.3-Micron Optical Lithography Using a Phase-Shifting Mask" by Tsuneo Terasawa et al, pp. 25-33.
"New Phase Shifting Mask with Self-Aligned Phase Shifters for a Quarter Micron Photolithography", by Akihiro Nitayama et al, IEDM 89-57, pp. 3.3.1-3.3.4.
SPIE vol. 1264 Optical/Laser Microlithography III (1990), "New Phase-Shifting Mask with Highly Transparent SiO.sub.2 Phase Shifters", by Isamu Hanyu et al, pp. 167-177.

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