Semiconductor device manufacturing: process – Making device array and selectively interconnecting
Reexamination Certificate
2006-05-02
2006-05-02
Vu, David (Department: 2818)
Semiconductor device manufacturing: process
Making device array and selectively interconnecting
C257S209000
Reexamination Certificate
active
07037762
ABSTRACT:
A phase changeable memory device includes a lower interlayer dielectric layer on a semiconductor substrate. A plurality of first phase changeable data storage elements is disposed on the lower interlayer dielectric layer. A middle interlayer dielectric layer covers the first phase changeable data storage elements and the lower interlayer dielectric layer. A plurality of second phase changeable data storage elements is disposed on the middle interlayer dielectric layer. The first and second phase changeable data storage elements are arrayed in rows and columns such that respective first phase changeable data storage elements are disposed between respective adjacent second phase changeable data storage elements in the rows and columns. A plate electrode overlies the first and second phase changeable data storage elements and is electrically connected to the first and second phase changeable data storage elements. Related fabrication methods are also disclosed.
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Horii Hideki
Joo Jae-Hyun
Myers Bigel & Sibley & Sajovec
Vu David
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