Phase change memory device resistant to stack pattern...

Active solid-state devices (e.g. – transistors – solid-state diode – Bulk effect device – Bulk effect switching in amorphous material

Reexamination Certificate

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C257S004000, C257S328000, C257S329000, C257S341000, C257S342000, C257SE45002, C257SE31002, C438S095000, C438S096000, C438S097000, C438S212000

Reexamination Certificate

active

07884344

ABSTRACT:
A phase change memory device resistant to stack pattern collapse is presented. The phase change memory device includes a silicon substrate, switching elements, heaters, stack patterns, bit lines and word lines. The silicon substrate has a plurality of active areas. The switching elements are connected to the active areas. The heaters are connected to the switching elements. The stack patterns are connected to the heaters. The bit lines are connected to the stack patterns. The word lines are connected to the active areas of the silicon substrate.

REFERENCES:
patent: 2008/0011997 (2008-01-01), Moniwa et al.
patent: 2008/0149910 (2008-06-01), An et al.
patent: 2009/0065758 (2009-03-01), Chao
patent: 2009/0302299 (2009-12-01), Chang
patent: 100790449 (2007-12-01), None
patent: 100791008 (2007-12-01), None
patent: 1020080006487 (2008-01-01), None
patent: 1020080044523 (2008-05-01), None

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