Semiconductor device manufacturing: process – Having selenium or tellurium elemental semiconductor component
Reexamination Certificate
2008-01-18
2011-10-25
Landau, Matthew (Department: 2813)
Semiconductor device manufacturing: process
Having selenium or tellurium elemental semiconductor component
C438S682000, C257SE45002
Reexamination Certificate
active
08043888
ABSTRACT:
A method for forming a phase change memory cell (PCM) includes forming a heater for the phase change memory and forming a phase change structure electrically coupled to the heater. The forming a heater includes siliciding a material including silicon to form a silicide structure, wherein the heater includes at least a portion of the silicide structure. The phase change structure exhibits a first resistive value when in a first phase state and exhibits a second resistive value when in a second phase state. The silicide structure produces heat when current flows through the silicide structure for changing the phase state of the phase change structure.
REFERENCES:
patent: 4599705 (1986-07-01), Holmberg et al.
patent: 5780919 (1998-07-01), Chua et al.
patent: 6319799 (2001-11-01), Ouyang et al.
patent: 6545287 (2003-04-01), Chiang
patent: 6605821 (2003-08-01), Lee et al.
patent: 6838692 (2005-01-01), Lung
patent: 6846734 (2005-01-01), Amos et al.
patent: 6967175 (2005-11-01), Ahmed et al.
patent: 7075131 (2006-07-01), Chen
patent: 7238601 (2007-07-01), Mathew et al.
patent: 7479671 (2009-01-01), Breitwisch et al.
patent: 7719039 (2010-05-01), Muralidhar et al.
patent: 7811851 (2010-10-01), Muralidhar et al.
patent: 2005/0023633 (2005-02-01), Yeo et al.
patent: 2005/0029503 (2005-02-01), Johnson
patent: 2006/0177998 (2006-08-01), Lin et al.
patent: 2007/0069249 (2007-03-01), Hayakawa
patent: 2007/0096206 (2007-05-01), Chidambarrao
patent: 2007/0097738 (2007-05-01), Asano et al.
patent: 2007/0161171 (2007-07-01), Burnett et al.
patent: 2008/0186760 (2008-08-01), Elmegreen et al.
patent: 2008/0224178 (2008-09-01), Pacha et al.
patent: 2008/0251779 (2008-10-01), Kakoschke et al.
patent: 2009/0184309 (2009-07-01), Mathew et al.
patent: 2010/0001248 (2010-01-01), Wouters et al.
patent: 2010/0117045 (2010-05-01), Lee et al.
Quirk et al., Semiconductor Manufacturing Technology, Prentice-Hall, Inc., Upper Saddle River, NJ, © 2001, pp. 309-312.
Lankhorst; “Low-cost and nanoscale non-volatile memory concept for future silicon chips”; Philips Research Laboratories, the Netherlands.
Non-Published U.S. Appl. No. 11/864,257, filed Sep. 28, 2007, with first named inventor Ramachandran Muralidhar.
Non-Published U.S. Appl. No. 11/864,246, filed Sep. 28, 2007, with first named inventor Ramachandran Muralidhar.
Restriction mailed May 10, 2010 in U.S. Appl. No. 12/016,739.
Office Action mailed Jul. 26, 2010 in U.S. Appl. No. 12/016,739.
Zhang et al.; “An Integrated Phase Change Memory Cell With Ge Nanowire Diode for Cross-Point Memory”; 2007 Symposium on VLSI Technology Digest of Technical Papers; 2007; pp. 98-99; IEEE.
Nishi; “Current Trends and Status of Nanoelectronic Devices”; 2005 SINANO Workshop, Grenoble, France; 2005; 39 Pgs.
Chen et al.; “Ultra-Thin Phase-Change Bridge Memory Device Using GeSb”; IEDM Technical Digest; 2006; 4 Pgs.
Merget et al.; “Lateral phase change random access memory cell design for low power operation”; Microsystems Technology Technical Paper; 2007; pp. 169-172; Microsystem Technology.
Quirk et al., “Semiconductor Manufacturing Technology”, 2001; pp. 309-312, Pearson Education International/Prentice Hall.
Kim, SB, et al., “Integrating Phase-Change Memory Cell with Ge Nanowire Diode for Crosspoint Memory—Experimental Demonstration and Analysis”, IEEE Transactions on Electron Devices, vol. 55, No. 9, Sep. 2008, pp. 2307 and 2313.
Lankhorst, “Low-cost and nanoscale non-volatile memory concept for future silicon chips”, Phillips Research Laboratories, the Netherlands.
Office Action, U.S. Appl. No. 12/016,739, Restriction, May 10, 2010.
Office Action, U.S. Appl. No. 12/016,739, Rejection, Jul. 26, 2010.
Office Action, U.S. Appl. No. 12/016,739, Final Rejection, Jan. 5, 2011.
U.S. Appl. No. 12/016,739, Office Action—Rejection, Jul. 14, 2011.
Jawarani Dharmesh
Mathew Leo
Merchant Tushar P.
Muralidhar Ramachandran
Clingan, Jr. James L.
Dolezal David G.
Freescale Semiconductor Inc.
Kim Sun M
Landau Matthew
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