Phase change material containing fusible particles as...

Details Phase change material containing fusible particles as... Phase change material containing fusible particles as...

2011-06-14

2011-06-14

Jackson, Monique R (Department: 1787)

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Including a second component containing structurally defined...

C428S323000, C029S592100, C029S832000

Reexamination Certificate

active

07960019

ABSTRACT:
An electronic assembly having a microelectronic die, a heat spreader and a heat sink. A first thermal interface material is disposed between the microelectronic die and the heat spreader. A second thermal interface material is disposed between the heat spreader and a heat sink. The first and second interface materials each comprising a phase change polymer, a solderable material and a plurality of thermally conductive non-fusible particles. The solderable material interconnecting the non-fusible particles to form a plurality of columnar structures within the phase change polymer.

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