Measuring and testing – Vibration – By mechanical waves
Patent
1990-05-17
1992-02-18
Williams, Hezron E.
Measuring and testing
Vibration
By mechanical waves
73582, G01N 2904
Patent
active
050883275
ABSTRACT:
Acoustical radiation is generated and applied to the bonding interface between a radiation transmission material and a radiation attenuating material to determine adhesion quality by extraction of data from a response signal produced by echoes reflected from both the interface and the radiation entry surface on the radiation transmissive material exposed to the generated acoustical radiation. Signal phase cancellation between the echoes from the entry surface and bonding interface produce a signal signature from which the quality of bonding is evaluated. By partial attenuation of the echo from the entry surface, the signature is maximized.
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"Ultrasonic Procedures for Predicting Adhesive Bond Strength", by Joseph L. ose et al., Mat. Eval., Jun. 1973, pp. 109-114.
Arana Louis M.
Shuster Jacob
The United States of America as represented by the Secretary of
Walden Kenneth E.
Williams Hezron E.
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