Permeable conductive shield having a laminated structure

Details Permeable conductive shield having a laminated structure Permeable conductive shield having a laminated structure

2006-11-14

2006-11-14

Reichard, Dean A. (Department: 2831)

Electricity: conductors and insulators

Anti-inductive structures

Shielded

C174S252000, C174S259000, C174S350000, C174S386000, C257S717000, C361S804000, C361S818000, C454S184000

Reexamination Certificate

active

07135644

ABSTRACT:
A permeable conductive shield providing protection from electromagnetic interference and electrostatic discharge has a laminated structure suitable for application to the foil side or the component side of a circuit board. The laminated structure includes an array of foam spacers arranged with spaces between them, a layer of foam attached to the top of the spacers, a first insulating sheet on the layer of foam spacers; a conductive sheet on the first insulating sheet, and a second insulating sheet on the conductive sheet. Each of the layers has a multiplicity of through holes aligned with corresponding through holes in the other layers and with the spaces between the foam spacers so as to allow airflow through the structure. The layers are bonded together with intervening adhesive layers. A pressure-sensitive adhesive is applied to the bottom of the spacers for attaching the permeable conductive shield to the circuit board.

REFERENCES:
patent: 5928076 (1999-07-01), Clements et al.
patent: 6297446 (2001-10-01), Cherniski et al.
patent: 6351394 (2002-02-01), Cunningham
patent: 6426459 (2002-07-01), Mitchell
patent: 6483719 (2002-11-01), Bachman
patent: 6496386 (2002-12-01), Warzecha et al.
patent: 6563198 (2003-05-01), Caldwell
patent: 6763576 (2004-07-01), Watchko et al.
patent: 6768524 (2004-07-01), Ju
patent: 6784363 (2004-08-01), Jones
patent: 6884937 (2005-04-01), Mistry et al.
patent: 6947294 (2005-09-01), Lin et al.
patent: 2003/0091777 (2003-05-01), Jones et al.
patent: 2003/0222249 (2003-12-01), Bunyan et al.
patent: 2004/0172502 (2004-09-01), Lionetta et al.
patent: 2006/0113107 (2006-06-01), Williams

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