Permanganate desmear process for printed wiring boards

Details Permanganate desmear process for printed wiring boards Permanganate desmear process for printed wiring boards

1998-09-21

1999-11-16

Gulakowski, Randy

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

134 41, 510175, C03C 2300, C23G 102, C11D 904

Patent

active

059850400

ABSTRACT:
An improved desmear process for removing resin smeared on an interior wall of a through hole drilled in a resinous substrate, especially resinous substrates made from epoxy, polyimide, cyanate ester resins and bis-maleimide triazine epoxy resins. The process involves contacting the resin smear with a solvent solution to soften the resin smear, followed by treatment with an alkaline permanganate solution to remove the softened resin, and treatment with a neutralizer to neutralize and remove the permanganate residues. The solvent solution comprises a mixture of at least two solvent components, with at least one solvent component being selected from the group consisting of gamma-butyrolactone, ethyl-3-ethoxypropionate, N-ethyl-2-pyrrolidone, N-cyclohexyl-2-pyrrolidone, N-(2-hydroxyethyl)-2-pyrrolidone, and N-octyl-2-pyrrolidone. The solvent solution is selective for the softening and removal of epoxy, polyimide, cyanate ester resins and bis-maleimide triazine epoxy resins.

REFERENCES:
patent: 4117080 (1978-09-01), Kawasaki et al.
patent: 4316322 (1982-02-01), Tranberg
patent: 4425380 (1984-01-01), Nuzzi et al.
patent: 4592852 (1986-06-01), Courduvelis et al.
patent: 4601783 (1986-07-01), Krulik
patent: 4640719 (1987-02-01), Hayes et al.
patent: 4775557 (1988-10-01), Bastenbeck et al.
patent: 4820548 (1989-04-01), Courduvelis
patent: 4853095 (1989-08-01), D'Ambrisi
patent: 4873122 (1989-10-01), Darken
patent: 4911802 (1990-03-01), D'Ambrisi
patent: 5019229 (1991-05-01), Grapentin et al.
patent: 5032427 (1991-07-01), Kukanskis et al.
patent: 5132038 (1992-07-01), Kukanskis et al.
patent: 5271775 (1993-12-01), Asano et al.
patent: 5311660 (1994-05-01), Alpaugh et al.
patent: 5334331 (1994-08-01), Fusiak
patent: 5427895 (1995-06-01), Magnuson et al.
patent: 5473118 (1995-12-01), Fukutake et al.
patent: 5554312 (1996-09-01), Ward
patent: 5558109 (1996-09-01), Cala et al.
patent: 5612303 (1997-03-01), Takayanagi et al.
patent: 5688753 (1997-11-01), Cala et al.
patent: 5690747 (1997-11-01), Doscher
patent: 5730890 (1998-03-01), Bickford et al.
patent: 5755893 (1998-05-01), Cala et al.
patent: 5798323 (1998-08-01), Honda et al.
patent: 5800858 (1998-09-01), Bickford et al.
patent: 5814588 (1998-09-01), Cala et al.
Neusch, "Engineer's Fact File, Primer on High-Performance Laminates, " Electronic Packaging & Production, p. 39 (Jun., 1997).
Spitz, "Specialty Laminates Fill Special Needs, " Electronic Packaging & Production, pp. 108-111 (Feb., 1989).

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