Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1992-08-28
1993-08-10
Seidel, Richard K.
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
228226, 2282628, 22826231, 437190, B23K 3526, B23K 3102, H01L 2144
Patent
active
052341534
ABSTRACT:
A laser device is bonded to a diamond submount by means of a procedure including (1) codepositing an auxiliary layer, on a layer of barrier metal that has been deposited overlying the submount, followed by (2) depositing a wetting layer on the auxiliary layer, and (3) by depositing a solder layer comprising alternating metallic layers, preferably of gold and tin sufficient to form an overall tin-rich gold-tin eutectic composition. The barrier metal is typically W, Mo, Cr, or Ru. Prior to bonding, a conventional metallization such as Ti-Pt-Au (three layers) is deposited on the laser device's bottom ohmic contact, typically comprising Ge. Then, during bonding, the solder layer is brought into physical contact with the laser device's metallization under enough heat and pressure, followed by cooling, to form a permanent joint between them. The thickness of the solder layer is advantageously less than approximately 5 .mu.m. The wetting layer is preferably the intermetallic compound Ni.sub.3 Sn.sub.4, and the auxiliary layer is formed by codepositing the metallic components of this intermetallic together with the barrier metal.
REFERENCES:
patent: 3396454 (1968-08-01), Murdock et al.
patent: 4290079 (1981-09-01), Carpenter et al.
patent: 4360142 (1982-11-01), Carpenter et al.
patent: 4757934 (1988-07-01), Greenstein
patent: 4772935 (1988-09-01), Lawler et al.
patent: 4840302 (1989-06-01), Gardner et al.
Bacon Donlad D.
Katz Avishay
Lee Chien-Hsun
Tai King L.
Wong Yiu-Man
AT&T Bell Laboratories
Caplan David I.
Knapp Jeffrey T.
Seidel Richard K.
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