Permanent magnet strucure for use in a sputtering magnetron

Details Permanent magnet strucure for use in a sputtering magnetron Permanent magnet strucure for use in a sputtering magnetron

1996-02-23

1999-02-02

Nguyen, Nam

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429816, 2042982, C23C 1434

Patent

active

058659706

ABSTRACT:
A dipole permanent magnet structure for use in a sputtering magnetron in which a central magnet structure having a magnetic field orientation parallel to a base plate, and upon which the central magnet is mounted, is placed adjacent to a first salient magnet having a magnetic field orientation orthogonal to the magnetic field orientation of the central magnet. A second salient magnet, located adjacent to the central magnet structure, has a magnetic field orientation orthogonal to the magnetic field orientation of the central magnet, but opposite polarity of the first salient magnet. The structure provides increased magnetic field strength and intensity along the working face of the sputtering magnetron to saturate and penetrate a target material inserted into the vacuum chamber of a sputtering system to facilitate the sputtering process.

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