Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2000-02-09
2002-07-30
Paladini, Albert W. (Department: 2827)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S261000, C361S807000, C361S808000
Reexamination Certificate
active
06426466
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Technical Field
The present invention relates generally to printed wiring board technology, and more particularly, to a printed wiring board wherein the power input is supplied to the board along the periphery of the board.
2. Related Art
Technology demands smaller semiconductor devices having higher functionality, which typically results in more densely packed printed wiring boards. The amount of space on the surface of the board available to mount active components becomes scarce as the complexity of the device increases. A significant user of printed wiring board surface space is the input power. Typically, numerous plated through holes are needed within the board to provide input power. In addition to eliminating a large amount of surface space, the plated through holes also significantly reduce the amount of wiring channels available for connecting power planes within the board. In addition, high end printed wiring boards typically require power busses to improve power distribution throughout the board, which also monopolize a large portion of the board surface. This means that a significant amount of printed wiring board surface area is devoted to the power supply.
Accordingly, there exists a need in the industry for a printed wiring board capable of solving the above-mentioned problems.
SUMMARY OF THE INVENTION
The present invention solves the above-stated problems by providing a peripheral power board structure. In particular, the present invention provides a printed wiring board and frame, wherein the input power is supplied at the periphery of the board.
The first general aspect of the present invention provides a printed wiring board structure comprising: a frame having a connection device attached to a first surface of the frame; and a printed wiring board having first and second adjacent surfaces, wherein the second surface includes a contacting surface which electrically contacts the connection device of the frame. This aspect provides the necessary input power at the periphery of the board, thereby increasing the amount of surface space available on the board for the attachment of other components. This aspect eliminates the plated through holes conventionally used to supply input power, since the input power is supplied along the edges of the board. This aspect also increases the power distribution throughout the board since there are numerous locations around the periphery of the board designed to receive and distribute input power, thereby reducing the number of surface busses used for power distribution.
The second general aspect provides a printed wiring board structure comprising: a printed wiring board having first and second adjacent surfaces; and a frame, including a connection device, wherein the connection device provides input power to the board at the second surface of the board. This aspect provides similar advantages as those associated with the first aspect.
The third general aspect provides a printed wiring board comprising: a substrate having first and second adjacent surfaces; a circuitized layer on the first surface; and an internal conductive layer, wherein portions of the internal conductive layer are exposed at the second surface and adapted to make electrical connection at the second surface. This aspect provides a printed wiring board having similar advantages as those associated with the first aspect.
The fourth general aspect provides a printed wiring board frame comprising: at least one connection device within an inner surface of the frame, providing input power at a periphery of a printed wiring board. This aspect provides a frame having similar advantages as those associated with the first aspect.
The foregoing and other features and advantages of the invention will be apparent from the following more particular description of preferred embodiments of the invention.
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Chamberlin Bruce J.
Lauffer John M.
Stack James R.
International Business Machines - Corporation
Paladini Albert W.
Schmeiser Olsen & Watts
Walter, Jr. Howard J.
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