Peripheral/area wire bonding technique

Details Peripheral/area wire bonding technique Peripheral/area wire bonding technique

1987-06-15

1989-01-03

Edlow, Martin H.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 69, 357 70, 357 72, 174 524, H01L 2348, H01L 2330, H02G 1308

Patent

active

047960787

ABSTRACT:
An electronic assembly having a semiconductor device back bonded to a first lead frame. An adhesive insulative tape is placed on the first lead frame and the device. A second lead frame is mounted on the adhesive tape. Electrical contacts by wire bonds are established between the device and the first and second lead frames.

REFERENCES:
patent: 3838984 (1974-10-01), Crane et al.
patent: 4330790 (1982-05-01), Burns
patent: 4438181 (1984-03-01), Schroeder
patent: 4496965 (1985-01-01), Orcutt et al.
patent: 4675985 (1987-06-01), Goto

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