Perimeter trace probe for plastic ball grid arrays

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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Details

324755, 324757, 324760, G01R 3102

Patent

active

060642149

ABSTRACT:
A test probe assembly for testing integrated circuit (IC) packages mounted onto a ball grid array is described. The test probe assembly can also be used to interconnect test instrumentation to the ball grid array without removal from the circuit in which it is mounted and with a minimal impact on the performance of the circuit. Contacts on the test probe assembly make electrical contact to test traces fabricated on the top side of the ball grid array package.

REFERENCES:
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patent: 5646542 (1997-07-01), Zamborelli et al.
patent: 5680057 (1997-10-01), Johnson
patent: 5708222 (1998-01-01), Yonezawa et al.
patent: 5731709 (1998-03-01), Pastore et al.
patent: 5825192 (1998-10-01), Hagihara
patent: 5859538 (1999-01-01), Self

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