Perimeter clamp for mounting and aligning a semiconductor compon

Details Perimeter clamp for mounting and aligning a semiconductor compon Perimeter clamp for mounting and aligning a semiconductor compon

1998-02-27

2000-07-04

Cuchlinski, Jr., William A.

Electricity: conductors and insulators

Anti-inductive structures

Conductor transposition

174 163, 174 521, 361719, 361704, 29447, 2952501, H05K 900

Patent

active

060841788

ABSTRACT:
A package for heat sinks and semiconductor components that adequately dissipates heat from semiconductor components without damaging or bending the semiconductor component electrical grid terminals and without imposing mechanical stress on the semiconductor component. The package includes both the heat sink and the semiconductor component situated in one unit that minimizes the thermal path. The heat sink and semiconductor component package may be packaged in a field replaceable unit (FRU) and may act as a handle for use in its own replacement. The FRU contains the heat sink and the semiconductor component in one unit, and thereby enables safe, simplified, and cost effective maintenance, including removal and addition of the semiconductor components, outside of the manufacturing environment. The package further includes a docking assembly mounted on a printed circuit board that orients and positions the FRU to align the semiconductor component and the electrical grid terminals for insertion on the printed circuit board.

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