Cutting – Processes – Puncturing
Patent
1992-11-04
1995-02-07
Rada, Rinaldi I.
Cutting
Processes
Puncturing
83 18, 83175, 83660, B26F 124
Patent
active
053867521
ABSTRACT:
A perforating device for punching pores in shrink-wrap film as the film moves along a film path is described. A biasing apparatus is used to bias the film towards a tension-creating apparatus and a microperforator apparatus so that pores can be punched in the film. An embodiment of the invention uses microperforator pin wheels, having a plurality of conically-shaped pins, and gripper wheels connected to a microperforator shaft. A rotary brush is connected to a rotary brush shaft. Shrink-wrap film is threaded between the microperforator shaft and the rotary brush shaft, and then pulled by an operator to wrap a package. The rotary brush biases the film towards the microperforator pin wheels and the gripper wheels, so that the pins on the micoperforator pin wheels puncture the film as it is being pulled. The rotary brush shaft can be adjusted to permit film to be threaded, and to control the size of the pores to be punched into the film. In addition, the amount and location of the microperforator pin wheels and the gripper wheels connected to the microperforator shaft can be changed so that the device can be customized to provide different patterns of pores as well as to control the amount of pores to be punched.
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"Shrink Film Perforator Units-Single Wound Web Machines" Reynolds Metals Company, Flexible Packaging Division, dated Oct. 30, 1992.
Rada Rinaldi I.
Weldotron of Delaware, Inc.
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