Perforating and slitting die sheet, methods of constructing the

Etching a substrate: processes – Forming or treating an article whose final configuration has...

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216 41, 216 47, 83861, 83862, 83881, B44C 122, B26D 306, B26D 1100

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061362093

ABSTRACT:
A first method of constructing a die sheet includes covering a die surface with a first, spaced pattern of a first photo-resist material and then covering the first pattern with a second, continuous pattern of a second photo-resist material. A chemical removes material from sections not covered by the second pattern and the second pattern is then removed. A chemical removes material from die surface sections not covered by the first pattern. A second method of constructing a die sheet includes covering sections of a die surface with a pattern of photo-resist material having alternating slitting segments and wider perforating segments. A chemical removes material from uncovered sections and completely undercuts the slitting segments to form slitting sections and undercuts the perforating segments to form higher extending perforating sections.

REFERENCES:
patent: 2346230 (1944-04-01), Ormond
patent: 4102735 (1978-07-01), Weglin
patent: 4135964 (1979-01-01), Tanaka et al.
patent: 4934231 (1990-06-01), Chesnut et al.
patent: 5714079 (1998-02-01), Mycek et al.
patent: 5761982 (1998-06-01), Abt et al.

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