Penetrating hole type LED chip package structure using a...

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – Plural light emitting devices

Reexamination Certificate

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C361S761000

Reexamination Certificate

active

07741648

ABSTRACT:
An LED chip package structure includes a ceramic substrate, a conductive unit, a hollow ceramic casing, many LED chips, and a package colloid. The ceramic substrate has a main body, many protrusions extended from the main body, many penetrating holes respectively penetrating through the protrusions, and many half through holes formed on a lateral side of the main body and respectively formed between each two protrusions. The conductive unit has many first conductive layers respectively formed on the protrusions, many second conductive layers respectively formed on inner surfaces of the half through holes and a bottom face of the main body, and many third conductive layers respectively filled in the penetrating holes. The hollow ceramic casing is fixed on the main body to form a receiving space. The LED chips is received in the receiving space. The package colloid is filled in the receiving space for covering the LED chips.

REFERENCES:
patent: 4890383 (1990-01-01), Lumbard et al.
patent: 6355946 (2002-03-01), Ishinaga
patent: 6392294 (2002-05-01), Yamaguchi
patent: 2002/0153835 (2002-10-01), Fujiwara et al.
patent: 2005/0035357 (2005-02-01), Fjelstad
patent: 2005/0116235 (2005-06-01), Schultz et al.

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