Pendulum with bending spring joint

Details Pendulum with bending spring joint Pendulum with bending spring joint

1988-01-20

1990-09-04

Olszewski, Robert P.

Spring devices

Bendable along flat surface

Flexural support

156647, 267150, 267158, 267182, F16F 118

Patent

active

049538349

ABSTRACT:
A micromechanical bending spring joint is formed of selectively etched wafer material. The joint includes a pair of leaf springs arranged alongside each other. Each spring is inclined at an oblique angle to the opposed surfaces of the wafer and such springs cross to define a point of intersection. The joint, selectively etched from a single wafer, is characterized by high precision of fulcrum position, bending spring constant and transverse axis rigidity.

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