Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1997-02-25
1998-06-30
Stemmer, Daniel
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
29832, 347 87, B41J 2175
Patent
active
057728291
ABSTRACT:
An inkjet pen is formed by a pen body, flex circuit and silicon substrate. The pen body includes a first arm and a second arm upon which the substrate rests. The flex circuit is attached to the substrate and to regions of the pen body. Contact between the substrate and the arms define fulcrum points for the arms. The first arm and second arm are forced to rotate about their respective fulcrums during thermal expansion and thermal contraction. During cooling, the rotational force counters a contractive force along the pen body region contacting the flex circuit. The countering force reduces the degree of contraction by the pen body. Without such counter-force component the pen body contracts more than the flex circuit imposing a compressive tension of the flex circuit. With such counter-force, the compressive tension is reduced or eliminated. As such compressive force was the source of buckling in prior configurations, circuit, such buckling source is eliminated.
REFERENCES:
patent: 5189787 (1993-03-01), Reed et al.
patent: 5506608 (1996-04-01), Marler et al.
"Adhesive Material And Equipment Selection For The HP DeskJet 500C/Desk Writer C Color Print Cartridge"; Douglas J. Reed & Terry M. Lambright; Aug. 1992; Hewlett-Packard Journal; vol. 43, No. 4; pp. 84-86.
"Automated Assembly Of The HP DeskJet 500C/Desk Writer C Color Print Cartridge"; Lee S. Mason & Mark C. Huth; Aug. 1992; Hewlett-Packard Journal; vol. 43; No. 4; pp. 77-83.
Hewlett--Packard Company
Stemmer Daniel
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