Batteries: thermoelectric and photoelectric – Thermoelectric – Peltier effect device
Patent
1997-01-24
1998-11-24
Gorgos, Kathryn L.
Batteries: thermoelectric and photoelectric
Thermoelectric
Peltier effect device
136224, 136225, 136230, 136237, 62 32, H01L 3502, H01L 3508
Patent
active
058410643
DESCRIPTION:
BRIEF SUMMARY
This is a national stage application of PCT/JP96/01421, filed May 27, 1996.
FIELD OF THE INVENTION
The present invention relates to a Peltier effect module having a plurality of Peltier effect elements.
DESCRIPTION OF THE PRIOR ART
A conventional Peltier effect module has a parallel arrangement of plural Peltier effect elements, which are thermoelectric conversion elements, between a pair of substrates. The Peltier effect elements are connected to the connection electrodes disposed on the substrates so as to connect said the elements electrically in series and thermally in parallel. The perimeter around the Peltier effect elements between the substrates is sealed to achieve a moisture-resistant module construction and prevent deterioration of the Peltier effect elements as a result of humidity. This seal may be formed by filling said perimeter area with a butyl rubber, silicon rubber, or other sealant as described in Japanese Laid-Open Patent Publication 6-174329, by enclosing the Peltier effect module in a sealed bag as described in Japanese Laid-Open Patent Publication 6-294562, or by forming a seal wall by filling said perimeter area with a plastic adhesive as described in Japanese Laid-Open Patent Publication 2-83446.
A problem with such Peltier effect modules in which a seal is formed from butyl rubber or silicon rubber, or a seal wall is formed by filling the gap between the substrates with an adhesive, is that water vapor is able to penetrate the module from the gap between the twisted wire and plastic sheathing used in the lead wires. The adhesive strength of the adhesive material also deteriorates with age, forming a gap between the adhesive body and the substrate through which moisture vapor can penetrate the module. Over the long term, these configurations thus permit the penetration of moisture vapor, which corrodes the Peltier effect module components and leads to electrical shortcircuit.
Preventing a drop in thermal conductivity is also a problem in Peltier effect modules that use an adhesive.
Another problem with Peltier effect modules encased in a sealed bag is poor thermal performance. More specifically, even if the material used for the bag enclosure has high thermal conductivity, the use of the bag itself greatly reduces the overall thermal conductivity of the module, resulting in poor thermal performance.
DISCLOSURE OF THE INVENTION
An object of the present invention is therefore to provide a Peltier effect module achieving improved moisture resistance without reducing thermal performance or assembly characteristics.
To achieve the above object, a Peltier effect module comprising a parallel arrangement of plural Peltier effect elements between a pair of substrates with said Peltier effect elements connected to connection electrodes disposed on the substrates is characterized according to the present invention by a hollow seal frame surrounding the Peltier effect element array section with a seal formed by a bond between both end edges of the seal frame and the substrates.
A power supply lead electrode formed in a closed loop enclosing the connection electrode group may be further provided on each substrate with both open ends of the seal frame connected to said power supply lead.
The hollow seal frame may be made from a variety of constructions, including a plastic member with a metal coating formed at the connection with the power supply lead, a drawn stainless steel plate with a metal coating formed at the connection with the power supply lead, or a paper member treated with a waterproofing process.
A terminal block for connection with external leads is preferably disposed as part of the power supply lead externally to the seal frame on the substrates.
The substrates are preferably made from a shaped aluminum member treated with an alumina or silicon dioxide layer. The connection electrodes and power supply lead are preferably made using a flame spray method. The pair of substrates may be further supported outside the seal frame by plural support pillars.
Because the perimete
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Inoue Hiroyuki
Komatsu Teruaki
Maekawa Nobuteru
Murase Shinya
Okada Hiroaki
Carroll Chrisman D.
Gorgos Kathryn L.
Matsushita Electric & Works Ltd.
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