Pellet bonding apparatus

Details Pellet bonding apparatus Pellet bonding apparatus

1994-10-20

1996-05-14

Ramsey, Kenneth J.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Plural discrete workpieces

228 491, H01L 2168

Patent

active

055160263

ABSTRACT:
A pellet bonding apparatus is disclosed, which comprises a wafer stage, a pellet removal/transfer mechanism, a pellet position correcting mechanism, and a bonding mechanism. In the wafer stage, the wafer ring unit can be rotated through an angle corresponding to each of a plurality of areas, into which a pellet group of a wafer ring unit provided on the wafer stage can be divided. The pellet position correcting mechanism rotates a rotary table through a predetermined angle irrespective of whether the wafer ring unit has been rotated or not, whereby pellet position correction is made such that the pellet has the same orientation at all times when being removed by the bonding mechanism. A sheet expander can set the wafer ring unit on the wafer stage. It has an expander ring with an end formed with air stream outlet ports. When a sheet of the wafer ring unit is supported on the end of the expander ring and expanded by lowering a wafer ring of the wafer ring unit with a press ring, an air layer is formed between the sheet and the expander ring end.

REFERENCES:
patent: 4103814 (1978-08-01), Nishioka
patent: 5351872 (1994-10-01), Kobayashi

Affiliated with

Also associated with

Rating

Pellet bonding apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Pellet bonding apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pellet bonding apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1891466