Peening process with reduction of dielectric breakdown to increa

Details Peening process with reduction of dielectric breakdown to increa Peening process with reduction of dielectric breakdown to increa

1997-06-13

2000-05-02

Pianalto, Bernard

Coating processes

Direct application of electrical, magnetic, wave, or...

427331, 427402, 4274301, 427554, B01J 1908

Patent

active

060570032

ABSTRACT:
The present invention provides a method of laser shock processing that can be used in a production environment that increases the peak pressure of the shock wave applied to the workpiece that increases residual compresses stresses therein. Such improvement is created by a reduction of dielectric breakdown of the transparent overlay layer utilized.
The method includes the steps of applying a transparent overlay such as water over the workpiece and reducing or limiting the thickness of the transparent overlay material. An alternate embodiment of the invention to reduce dielectric breakdown incorporates the use of a changing or circularly polarized laser beam as opposed to a linearly polarized laser beam.

REFERENCES:
Generation of shock waves by laser-induced plasma in confined geometry. Dr. Devaux, et al., Aug. 15, 1993, pp. 2268-2273.
Generations of shock waves by laser-matter interaction in confined geometry. D. Devaux, et al., Dec. 1, 1991, pp. 179-182.
Laser shock processing of aluminum alloys. P. Peyer, et al., Oct. 31, 1995, pp. 102-113.
American Institute of Physics, L. Berthe et ala. Sep. 15, 1997 pp. 2826-2832.
Jun. 11, 1993, David Devaux pp. 99, 140, and 152.
Catherine DuBouchet p. 62.
Ecole Nationale Superieure d'Arts et Metiers Centre d'Aix-en-Provence M. Cambarnous, et al., Dec. 1, 1994 p. 56.
Creation De Contraintes Residuelles Dans un Supeeralliage a Base de Nickel Par Choc Laser, Pierre Forget, Dec. 1, 1993, pp. 2-4-2-5.

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