Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
Reexamination Certificate
2005-09-20
2011-11-15
Landau, Matthew C (Department: 2813)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Subsequent separation into plural bodies
C438S118000, C438S455000, C438S457000, C257S684000, C257S783000, C257SE21570
Reexamination Certificate
active
08058146
ABSTRACT:
The present invention provides a method for manufacturing massively and efficiently a minute device which can receive or send data in contact, preferably, out of contact by forming an integrated circuit which is formed by a thin film over a large glass substrate and by peeling the integrated circuit from the substrate. Especially, an integrated circuit which is formed by a thin film is extremely thin, and so there is a threat that the integrated circuit is flied when transporting, and so handling thereof is difficult. In accordance with the present invention, a separating layer (also referred to as a peeling layer) is damaged at a plurality of times by at least two different kinds of methods (a damage due to laser light irradiation, a damage due to etching, or a damage due to a physical means), subsequently, the layer to be peeled can be efficiently peeled from a substrate. Further, handling of individual devices becomes easy by arching the peeled device.
REFERENCES:
patent: 6127199 (2000-10-01), Inoue et al.
patent: 6740411 (2004-05-01), Kojima et al.
patent: 6825820 (2004-11-01), Yamazaki et al.
patent: 7030551 (2006-04-01), Yamazaki et al.
patent: 7129567 (2006-10-01), Kirby et al.
patent: 7487373 (2009-02-01), Koyama
patent: 7564139 (2009-07-01), Kuwabara et al.
patent: 7630233 (2009-12-01), Kato et al.
patent: 7639248 (2009-12-01), Yamazaki et al.
patent: 7707442 (2010-04-01), Kato
patent: 7772523 (2010-08-01), Tanaka et al.
patent: 7786544 (2010-08-01), Yamazaki et al.
patent: 2002/0018060 (2002-02-01), Yamazaki et al.
patent: 2002/0044208 (2002-04-01), Yamazaki et al.
patent: 2002/0058387 (2002-05-01), Ito
patent: 2002/0068419 (2002-06-01), Sakaguchi et al.
patent: 2003/0032210 (2003-02-01), Takayama et al.
patent: 2003/0087503 (2003-05-01), Sakaguchi et al.
patent: 2004/0201023 (2004-10-01), Yamazaki et al.
patent: 2006/0273319 (2006-12-01), Dairiki et al.
patent: 2006/0276007 (2006-12-01), Nakata et al.
patent: 2008/0149931 (2008-06-01), Koyama
patent: 2009/0023251 (2009-01-01), Eguchi et al.
patent: 2011/0097834 (2011-04-01), Yamazaki et al.
patent: 08250745 (1996-09-01), None
patent: 08288522 (1996-11-01), None
patent: 10125929 (1998-05-01), None
patent: 10125930 (1998-05-01), None
patent: 10125931 (1998-05-01), None
patent: 2001-175832 (2001-06-01), None
patent: 2002-329181 (2002-11-01), None
patent: 2003174153 (2003-06-01), None
International Search Report (Application No. PCT/JP2005/017905) dated Dec. 27, 2005.
Written Opinion (Application No. PCT/JP2005/017905) dated Dec. 27, 2005.
Landau Matthew C
Malek Maliheh
Robinson Eric J.
Robinson Intellectual Property Law Office P.C.
Semiconductor Energy Laboratory Co,. Ltd.
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