Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Reexamination Certificate
2007-02-06
2007-02-06
Osele, Mark A. (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
C156S583200, C438S464000, C438S976000
Reexamination Certificate
active
11038479
ABSTRACT:
A peeling device11includes an adsorber15having an adsorbing face20A that adsorbs and retains a wafer W, and a peeling element17that holds a protective sheet H stuck to the wafer W, and peels off the protective sheet H from the wafer W through moving relatively to the adsorber15. The adsorber15and the peeling element17are arranged so as to peel off the protective sheet H from the wafer W intermittently through moving relatively to each other while a peeling operation and a counter-peeling operation are performed alternately.
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Kurosawa Tetsuya
Otsuka Masahisa
Lintec Corporation
Lowe Hauptman & Berner LLP.
Osele Mark A.
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