Peelable circuit board foil

Details Peelable circuit board foil Peelable circuit board foil

2007-07-10

2007-07-10

Lam, Cathy F. (Department: 1775)

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

C428S629000, C428S632000, C428S640000, C428S670000, C428S671000, C428S697000, C428S702000, C428S704000

Reexamination Certificate

active

11139056

ABSTRACT:
In one embodiment, a peelable circuit board foil (200) has a metal support layer (205) and a conductive metal foil layer (210) bonded by an inorganic high temperature release structure (215) that comprises a co-deposited layer (250) and a metal oxide layer (260). The co-deposited layer comprises an admixture of nickel and one or more of boron, phosphorus, and chromium. In a second embodiment, the peelable printed circuit foil (200) has a crystallized dielectric oxide layer (405) disposed on the metal foil layer and an electrode layer (415) disposed on the crystallized dielectric oxide layer, forming a dielectric peelable circuit board foil (400) that may be adhered to a layer of a flexible or rigid circuit board, after which the metal support layer can be peeled away, leaving a capacitive structure including the metal foil layer, the crystallized dielectric oxide layer, and the electrode layer.

REFERENCES:
patent: 6346355 (2002-02-01), Sugai et al.
patent: 6872468 (2005-03-01), Dean et al.

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