Peelable circuit board foil

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...

Reexamination Certificate

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Details

C428S629000, C428S632000, C428S640000, C428S670000, C428S671000, C428S697000, C428S702000

Reexamination Certificate

active

06872468

ABSTRACT:
In one embodiment, a peelable circuit board foil (200) has a metal support layer (205) and a conductive metal foil layer (210) bonded by an inorganic release material (215). The conductive metal foil layer has a an exposed surface (212) that is coated with a high temperature anti-oxidant barrier (220) and has a roughness less than 0.05 microns RMS. In a second embodiment, the peelable printed circuit foil (200) has a crystallized dielectric oxide layer (405) disposed on the exposed surface of the conductive metal foil layer and an electrode layer (415) disposed on the crystallized dielectric oxide layer, forming a dielectric peelable circuit board foil (400) that may be adhered to a layer of a flexible or rigid circuit board, after which the metal support layer can be peeled away, leaving a capacitive structure including the metal foil layer, the crystallized dielectric oxide layer, and the electrode layer.

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patent: 1 315 407 (2003-05-01), None
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patent: WO 0167465 (2001-09-01), None
“Lead Zirconate Titanaate Thin Films On Base-Metal Foils: An Approach For Embedded High K Passive Components” Journal of the American Ceramic Society, 84 (10) 2436 (2001).

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