Bottles and jars – Closures – Cap type
Patent
1978-11-28
1981-05-26
Robinson, Ellis P.
Bottles and jars
Closures
Cap type
40311, 215230, 215341, 215328, 215347, 260DIG37, 428202, 428204, 428209, 428413, 428416, 428418, 428461, 428463, 428501, 428506, 428515, 428516, 428520, 428522, B65D 4112, B32B 1508
Patent
active
042693217
ABSTRACT:
A peelable bonded structure having a peel strength of 0.05 to 5 kg/cm comprises a plurality of articles, at least one of which is made of metal, bonded together through a composite coating layer. The composite coating layer is composed of adjacent first and second coating layers at least one of which comprises (A) a modified olefin resin having a carbonyl group concentration of 0.01 to 200 milliequivalents per 100 g of the olefin resin and (B) a coating film-forming base resin at an (A)/(B) weight ratio of from 0.2/99.8 to 40/60 and has a multi-layer distribution structure having resin concentration gradients in the thickness direction such that the modified olefin resin (A) is distributed predominantly in the portion contiguous to the interface between the two coating layers and the base resin (B) is distributed predominantly in the opposite portion.
REFERENCES:
patent: 3233770 (1966-02-01), Waters
patent: 3361281 (1968-01-01), Kehe
patent: 3487124 (1969-12-01), Yeshin
patent: 3581690 (1971-06-01), Zapata
patent: 3633781 (1972-01-01), Zapata
patent: 4012270 (1977-03-01), Fitko
patent: 4034132 (1977-07-01), Manuel
patent: 4062997 (1977-12-01), Hotta
Ichinose Isao
Mori Fumio
Suzuki Noboru
Robinson Ellis P.
Toyo Seikan Kaisha Ltd.
LandOfFree
Peelable bonded structures and process for preparing same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Peelable bonded structures and process for preparing same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Peelable bonded structures and process for preparing same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-450060