Fishing – trapping – and vermin destroying
Patent
1994-09-30
1996-10-08
Breneman, R. Bruce
Fishing, trapping, and vermin destroying
H01L 21316
Patent
active
055631053
ABSTRACT:
Fluorine-doped oxide is formed that is resistant to water absorption by the use of two sources of silicon, one being the fluorine precursor and the other being available to react with excess fluorine from the fluorine precursor, thereby reducing the number of fluorine radicals in the layer; the fluorine precursor containing a glass-forming element that combines with the other glass constituents to carry into the gas a diatomic radical containing one atom of fluorine and one atom of the glass-forming element.
REFERENCES:
patent: 4246296 (1981-01-01), Chang
patent: 4386163 (1983-05-01), Kodama
patent: 4397670 (1983-08-01), Beall
patent: 4539068 (1985-09-01), Takagi et al.
patent: 4894352 (1990-01-01), Lane et al.
patent: 5124278 (1992-06-01), Bohling et al.
patent: 5215787 (1993-06-01), Homma
patent: 5254505 (1993-10-01), Kamiyama
patent: 5279865 (1994-01-01), Chebi et al.
patent: 5281557 (1994-01-01), Yu
patent: 5395796 (1995-03-01), Haskell et al.
patent: 5413967 (1995-05-01), Matsuda et al.
Takamori, "Process for Melting Multi-Component Oxyfluoride Glasses", IBM Tech. Disc. Bulletin, V22, N12, May 1980, pp. 5464-5465.
Afzali et al., "Passivation of the Aluminum Film of Direct Negative-Direct Plate", IBM Tech. Disc. Bulletin, V32, N8B, Jan. 1990, p. 465.
Bezama et al., "Microstructure and TCE Control for Glass Ceramic Substrates by Controlled Glass in Glass Phase Separation", IBM Tech. Disc. Bulletin, V33 N4, Sep. 1990, pp. 446-447.
Ida et al., "Reduction of Wiring Capacitance with New Low Dielectric SiOF Interlayer Film for High Speed/Low Power Sub-half Micron CMOS", 1994 Symposium on VLSI Tech. Digest of Technical Papers, Apr. 1994, pp. 59-60.
Fukada et al., "Preparation of SiOF Films with Low Dielectric Constant by ECR Plasma Chemical Vapor Deposition", Ext. Abstracts of the 1993 Int. Conf. on Solid State Devices and Materials, 1993, pp. 158-160.
Anand et al., "Fully Integrated Back End of the Line Interconnect Process for High Performance ULSIs", 1994 VMIC Conference, Jun. 7-8, 1994, pp. 15-21.
Usami et al., "Low Dielectric Constant Interlayer Using Fluorine-Doped Silicon Oxide", Jpn. J. Appl. Phys. vol. 33 (1994) Pt. 1, No. 1B, pp. 408-412.
Hidehiko, Nonaka, `Photochemical Vapor . . . Mechanism`, J. Appl. Phys., 64(8), 15 Oct. 1988.
Wolf, Stanley, `Si Proc. for the VLSI Era`, vol. 2, (1990), p. 362.
Dobuzinsky David M.
Matsuda Tetsuo
Nguyen Son V.
Ryan James G.
Shapiro Michael
Breneman R. Bruce
International Business Machines - Corporation
Whipple Matthew
LandOfFree
PECVD method of depositing fluorine doped oxide using a fluorine does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with PECVD method of depositing fluorine doped oxide using a fluorine, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and PECVD method of depositing fluorine doped oxide using a fluorine will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-56951