PDC cutter element having improved substrate configuration

Details PDC cutter element having improved substrate configuration PDC cutter element having improved substrate configuration

1996-09-04

1999-05-25

Bagnell, David J.

Boring or penetrating the earth

Bit or bit element

Specific or diverse material

761082, 451540, E21B 1046, E21B 1056

Patent

active

059062460

ABSTRACT:
A supporting substrate for supporting a diamond layer on a cutting element is disclosed which has an irregular surface defining the interface between the substrate and the diamond layer. The irregularities in the surface comprise closed loops that may vary in amplitude, frequency or both. The irregularities may comprise ridges or grooves or a combination of ridges and grooves.

REFERENCES:
patent: 4109737 (1978-08-01), Bovenkerk
patent: 4629373 (1986-12-01), Hall
patent: 4716975 (1988-01-01), Dennis
patent: 4784023 (1988-11-01), Dennis
patent: 4954139 (1990-09-01), Cerutti
patent: 4972637 (1990-11-01), Dyer
patent: 4984642 (1991-01-01), Renard et al.
patent: 4997049 (1991-03-01), Tank et al.
patent: 5007207 (1991-04-01), Phaal
patent: 5011515 (1991-04-01), Frushour
patent: 5037451 (1991-08-01), Burnand et al.
patent: 5120327 (1992-06-01), Dennis
patent: 5217081 (1993-06-01), Waldenstrom et al.
patent: 5351772 (1994-10-01), Smith
patent: 5355969 (1994-10-01), Hardy et al.
patent: 5379854 (1995-01-01), Dennis
patent: 5435403 (1995-07-01), Tibbitts
patent: 5469927 (1995-11-01), Griffin
patent: 5472376 (1995-12-01), Olmstead et al.
patent: 5477034 (1995-12-01), Dennis
patent: 5484330 (1996-01-01), Flood et al.
patent: 5484468 (1996-01-01), Ostlund et al.
patent: 5590728 (1997-01-01), Matthias et al.
patent: 5598750 (1997-02-01), Griffin et al.
patent: 5617928 (1997-04-01), Matthias et al.
patent: 5622233 (1997-04-01), Griffin
patent: 5711702 (1998-01-01), Devlin

Affiliated with

Also associated with

Rating

PDC cutter element having improved substrate configuration does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with PDC cutter element having improved substrate configuration, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and PDC cutter element having improved substrate configuration will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-396960