Etching a substrate: processes – Forming or treating electrical conductor article
Patent
1998-03-04
2000-12-19
Bell, Mark L.
Etching a substrate: processes
Forming or treating electrical conductor article
216 17, 216 18, 216 19, 216 20, 29852, 430314, 430318, 205125, 205126, 427 98, 427105, H01B 1300, H01K 310, G03C 500, C25D 502, B05D 512
Patent
active
061623652
ABSTRACT:
A process for making a printed circuit board is provided. The process employs a noble metal as an etch mask for subtractive circuitization and as a seed layer for secondary finishing. In a preferred embodiment of the invention, a dielectric is covered by a conductive layer of metal such as copper, a patterned photoresist is applied, additional copper is deposited on areas not covered by the photoresist, and a palladium etch mask/seed layer is deposited on the copper. The palladium layer remains sufficiently active for deposition of nickel or gold on the circuitry for purposes such as wire bonding.
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Bhatt Ashwinkumar C.
Gaudiello John Gerard
Bell Mark L.
Hailey Patricia L.
Hogg William N.
International Business Machines - Corporation
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