PCMO spin-coat deposition

Semiconductor device manufacturing: process – Having magnetic or ferroelectric component

Reexamination Certificate

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Details

C438S781000, C438S782000, C257S295000

Reexamination Certificate

active

07098043

ABSTRACT:
A Pr1-XCaXMnO3(PCMO) spin-coat deposition method for eliminating voids is provided, along with a void-free PCMO film structure. The method comprises: forming a substrate, including a noble metal, with a surface; forming a feature, such as a via or trench, normal with respect to the substrate surface; spin-coating the substrate with acetic acid; spin-coating the substrate with a first, low concentration of PCMO solution; spin-coating the substrate with a second concentration of PCMO solution, having a greater concentration of PCMO than the first concentration; baking and RTA annealing (repeated one to five times); post-annealing; and, forming a PCMO film with a void-free interface between the PCMO film and the underlying substrate surface. The first concentration of PCMO solution has a PCMO concentration in the range of 0.01 to 0.1 moles (M). The second concentration of PCMO solution has a PCMO concentration in the range of 0.2 to 0.5 M.

REFERENCES:
patent: 6664117 (2003-12-01), Zhuang et al.
patent: 2003/0148545 (2003-08-01), Zhuang et al.

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