PCB with inlaid outer-layer circuits and production methods...

Details PCB with inlaid outer-layer circuits and production methods... PCB with inlaid outer-layer circuits and production methods...

2006-07-25

2006-07-25

Chang, Richard (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S846000, C427S097100, C427S099300

Reexamination Certificate

active

07080448

ABSTRACT:
Method for fabricating printed circuit board employing optical engraving and metallization techniques to form a pre-designated circuit pattern on a transfer plate, wherein the pattern is transferred and inlaid to a dielectric material by lamination, a printed circuit is emerged after removal of said transfer plate and surface copper deposit is etched off. PCB produced by the present invention and characterized by its outer layer circuitry is inlaid into the dielectric material, thus having 3-sided adhesion between the circuitry and the dielectric material.

REFERENCES:
patent: 4925705 (1990-05-01), Hill

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