PCB supporting woven fabric and a PCB having the same

Details PCB supporting woven fabric and a PCB having the same PCB supporting woven fabric and a PCB having the same

2008-01-24

2010-11-09

Loney, Donald (Department: 1783)

Fabric (woven, knitted, or nonwoven textile or cloth, etc.)

Coated or impregnated woven, knit, or nonwoven fabric which...

Coated or impregnated inorganic fiber fabric

C442S218000, C442S219000, C428S172000, C428S209000, C428S365000, C428S901000, C361S748000, C174S255000

Reexamination Certificate

active

07829480

ABSTRACT:
The present invention is to provide a printed circuit board (PCB) supporting woven fabric and a PCB having the same. The PCB includes a supporting woven fabric, a filling resin body enveloping the supporting woven fabric and at least one signal trace arranged on the surface of the filling resin body. The supporting woven fabric is made by a number of warp fiberglass strands and weft fiberglass strands interlaced mutually, wherein each of the warp fiberglass strands initially crosses above one weft fiberglass strand to separately form a bump upwardly and passes through under the next at least two weft fiberglass strands. The invention aims to decrease the number of the bumps bulged thereof to make the PCB improved in effectiveness and speed of signal transmission.

REFERENCES:
patent: 4749611 (1988-06-01), Furuya
patent: 6325110 (2001-12-01), Scari et al.
patent: 2000-315846 (2000-11-01), None

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