PCB support plate for PCB via fill

Details PCB support plate for PCB via fill PCB support plate for PCB via fill

2005-02-15

2005-02-15

Lam, Cathy (Department: 1775)

Stock material or miscellaneous articles

Plural parts with edges or temporary joining means each...

C428S130000, C428S131000

Reexamination Certificate

active

06855385

ABSTRACT:
Apparatus for improved electronic substrate via and thru-hole filling, particularly through the use of drilled stand-offs formed by control-depth drilling oversized non-thru-holes and the use of inserted support pillars to prevent sagging of the substrate during filling. In particular: (1) a via fill stand off adapted for use with a substrate comprising at least two via holes to be filled, each of the via holes having a diameter of X mils, the standoff comprising at least one recess formed by control-depth drilling of holes having a diameter at least 12X mils; and (2) a via fill standoff adapted for use with a substrate comprising at least one via hole to be filled, the standoff comprising: at least one recess; and at least one support pillar positioned within the recess wherein the support pillar is not an integral part of the standoff.

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