PCB module support system

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Patent

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Details

257718, 361690, H05K 720

Patent

active

059994053

ABSTRACT:
A support apparatus is disclosed including a support structure for holding a printed circuit board module, a heat sink thermally coupled with the printed circuit board module, and a capture bar secured to the support structure. The support apparatus includes a holding member with extension members for securing the holding member to the main printed circuit board. The heat sink has a projection extending from one surface, and the capture bar frictionally engages with the projection. Standoffs are disposed between the main printed circuit board and a chassis surrounding the main printed circuit board. A method for cooling the printed circuit board module is also disclosed. The method comprises coupling the printed circuit board module with the holding member, and thermally coupling the heat sink with the printed circuit board module. The capture bar is coupled with the projection of the heat sink and is secured to the holding member. Standoffs are disposed under the main printed circuit board. The extension members of the holding member are secured to the main printed circuit board and to the chassis.

REFERENCES:
patent: 5699229 (1997-12-01), Brownell
patent: 5748446 (1998-05-01), Feightner et al.
patent: 5847928 (1998-12-01), Hinshaw et al.

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