PCB method and apparatus for producing landless interconnects

Details PCB method and apparatus for producing landless interconnects PCB method and apparatus for producing landless interconnects

2006-08-01

2006-08-01

Cuneo, Kamand (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S260000, C029S830000, C361S803000

Reexamination Certificate

active

07084354

ABSTRACT:
An electronic assembly is disclosed. The electronic assembly includes a lower portion and a first elongate trace formed on an upper surface of the lower portion. The trace is covered by an upper portion, and an opening formed through an upper surface of the upper portion extends to the trace to expose a portion of the trace. A second elongate trace is formed on the upper portion. A portion of the second elongate trace positioned in the opening formed through the upper surface of the upper portion contacts the first elongate trace through the opening to form an electrical interconnection between the first trace and the second trace.

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