PCB capable of releasing thermal stress

Details PCB capable of releasing thermal stress PCB capable of releasing thermal stress

2007-05-29

2007-05-29

Norris, Jeremy C. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S254000, C361S809000

Reexamination Certificate

active

10973601

ABSTRACT:
A PCB comprises a slender substrate, a thermal compression area and at least a slit. The thermal compression area, placed on the slender substrate, has a plurality of bonding pads for a plurality of TCPs to be mounted thereon and a plurality of dummy pads placed between the TCPs. The slit transversely crosses the thermal compression area and slices some of the dummy pads. When the TCPs are connected to the bonding pads of the PCB, the thermal compression area is heated to around 150° C. to 200° C. Therefore, the slit can block the thermal expansion to be accumulated along the longitudinal direction of the thermal compression area.

REFERENCES:
patent: 5043796 (1991-08-01), Lester
patent: 5945984 (1999-08-01), Kuwashiro
patent: 6787895 (2004-09-01), Jarcy et al.
patent: 2004/0129452 (2004-07-01), Owens
patent: 2005/0145413 (2005-07-01), Chang et al.

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