PCB and manufacturing method thereof

Details PCB and manufacturing method thereof PCB and manufacturing method thereof

2011-08-09

2011-08-09

Dinh, Tuan T (Department: 2835)

Metal working

Method of mechanical manufacture

Electrical device making

C029S846000, C029S830000, C174S266000

Reexamination Certificate

active

07992296

ABSTRACT:
A printed circuit board and a manufacturing method thereof are disclosed. The method in accordance with an embodiment of the present invention includes: providing a substrate on which a first insulation layer, a first circuit pattern, a second insulation layer and a resin layer are successively laminated; boring a through-hole penetrating the substrate; forming roughness on the resin layer by a desmear process; forming a via making an electrical connection between layers through the through-hole; and forming a second circuit pattern on the resin layer having roughness formed thereon.

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Korean Office Action issued in Korean Patent Application No. KR 10-2008-0004387 dated Jul. 29, 2010.
Korean Office Action, w/ partial English translation thereof, issued in Korean Patent Application No. KR 10-2008-0004387 dated Jan. 31, 2011.
Japanese Office Action, with Partial English Translation, issued in Japanese Patent Application No. 2009-004838, dated Apr. 5, 2011.

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