PC card with thermal management

Details PC card with thermal management PC card with thermal management

1997-06-23

2000-01-04

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361737, 361816, 174 521, 235492, 257707, 257628, H05K 720

Patent

active

060116900

ABSTRACT:
A PC card comprising a housing including top and bottom cover panels encloses at least one heat-generating circuit component, typically an IC device or package. A heat spreading element, which may be in the form of a copper sheet, is disposed in conduction heat transfer relationship with the at least one circuit component and at least one of the housing covers, the heat spreading element being adapted to receive heat from the at least one circuit component, to spread the heat uniformly and to transfer it to the at least one housing cover panel. From there, the heat is dissipated into the surrounding environment.

REFERENCES:
patent: 5208732 (1993-05-01), Baudouin et al.
patent: 5414253 (1995-05-01), Baudouin et al.
patent: 5590026 (1996-12-01), Warren et al.
patent: 5596486 (1997-01-01), Young et al.
patent: 5625228 (1997-04-01), Rogren
patent: 5854874 (1998-12-01), Yatsugi et al.

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