Pb-free, tin base solder composition

Details Pb-free, tin base solder composition Pb-free, tin base solder composition

1987-06-29

1988-07-19

Rutledge, L. Dewayne

Alloys or metallic compositions

Tin base

Copper containing

420561, C22C 1302, C22C 1300

Patent

active

047584076

ABSTRACT:
A lead free, cadmium free tin and tin/antimony based solder alloy having a wide melting range for joining copper tubes and brass pipe and fittings. The non-toxic tin based solder composition has a range of 92.5-96.9% tin, 3.0-5.0% copper, 0.1-2.0% nickel and 0.0-5.0% silver. The non-toxic tin/antimony based solder composition has a range of 87.0-92.9% tin, 4.0-6.0% antimony, 3.0-5.0% copper, 0.0-2.0% nickel and 0.0-0.5% silver and is especially suited for plumbing applications having tight loose fitting solder joints which are exposed to potable water.

REFERENCES:
patent: 4695428 (1987-09-01), Ballentine et al.

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