Pb-free soldering alloy

Alloys or metallic compositions – Tin base – Copper containing

Reexamination Certificate

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Details

C148S400000

Reexamination Certificate

active

06440360

ABSTRACT:

TECHNICAL FIELD
The present invention relates to Pb-free soldering alloy which does not include Pb.
BACKGROUND TECHNOLOGY
Eutectic soldering alloy which comprises Sn in 60 wt. % and Pb in 40 wt. % or which comprises Sn in 63 wt. % and Pb in 37 wt. % has been used for a long time in the field of the jointing technology of electronic parts.
In case an electronic device assembled by soldering by use of Pb-rich solder is put on a waste yard, there arises an environmental problem that acid rain dissolves Pb out of the solder joint and contaminates the underground water. It is said that when Pb enters a human body Pb puts the central nerve out of order and causes a hemoglobin trouble in the blood.
Thus it is the purpose of the present invention to propose Pb-free soldering alloy which does not include any amount of Pb to prevent the environment from being contaminated by Pb in case the soldered product is put on a waste yard and which makes it possible to enhance the mechanical strength of the soldered joint by using said Pb-free soldering alloy.
DISCLOSURE OF INVENTION
The Pb-free soldering alloy according to the present invention is characterized in that it comprises Cu in 0.05 to 2.0 wt. %, Ni in 0.001 to 2.0 wt. % and Sn in the balance.
According to the present invention, the addition of Ni in 0.001 to 2.0 wt. % to Pb-free Sn—Cu soldering alloy enhances the mechanical strength by about 15 to 30%.
Cu—Ni alloy is perfect solid solution and the added Ni is combined with Cu crystallized out of two-elemental Sn—Cu alloy as a solid solution. In the result, the mechanical strength of the soldering alloy is enhanced.
Furthermore, as the soldering alloy does not include Pb, even when the soldered product is put on a waste yard, the environment can be prevented from being contaminated.


REFERENCES:
patent: 5837191 (1998-11-01), Gickler
patent: 5863493 (1999-01-01), Achari et al.
patent: 6139979 (2000-10-01), Takaoka et al.
patent: 19816671 (1998-10-01), None
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patent: 8045940 (1996-02-01), None
patent: 10034376 (1998-02-01), None
patent: 10286689 (1998-10-01), None
patent: 11277290 (1999-10-01), None
patent: 9712719 (1997-04-01), None
patent: 9948639 (1999-09-01), None

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