Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Patent
1995-02-24
1996-06-18
Rosenbaum, Mark
Stock material or miscellaneous articles
All metal or with adjacent metals
Composite; i.e., plural, adjacent, spatially distinct metal...
420560, 2282629, B23K 3526
Patent
active
055276288
ABSTRACT:
A Pb-free solder includes a ternary eutectic composition consisting essentially of about 93.6 weight % Sn-about 4.7 weight % Ag-about 1.7 weight % Cu having a eutectic melting temperature of about 217.degree. C. and variants of the ternary composition wherein the relative concentrations of Sn, Ag, and Cu deviate from the ternary eutectic composition to provide a controlled melting temperature range (liquid-solid "mushy" zone) relative to the eutectic melting temperature (e.g. up to 15.degree. C. above the eutectic melting temperature).
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"Developing Lead-Free Solders: A Challenge and Opportunity"; JOM, vol. 45, No. 7, Jul. 1993, pp. 1 and 13; Sungho Jin.
Anderson Iver E.
Miller Chad M.
Smith John F.
Terpstra Robert L.
Yost Frederick G.
Iowa State University Research Foudation, Inc.
Knapp Jeffrey T.
Rosenbaum Mark
Sandia Corporation
Timmer Edward J.
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