Patterning of polyimide films with ultraviolet light

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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156643, 1566591, 156668, 156904, 219121LM, 427 531, 427 541, 427 96, 430945, B44C 122, C03C 2506, C03C 1500, B05D 306

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045087490

ABSTRACT:
A method for etching a polyimide body which involves directing U.V. radiation having a wavelength between about 240 to 400 nm. onto the body is described. The radiation is continued to be applied to the body for sufficient time to cause a direct etching of the body where the radiation impinges upon the body. The method is particularly useful where the U.V. radiation is passed through a mask located between the source of the ultraviolet radiation and the body so that a radiation pattern is projected onto the body where the direct etching takes place. The etching can be caused to produce openings having a positive slope in the radiation pattern upon the polyimide layer. The advantage of the positive slope is particularly great where a coating such as a metal layer is deposited over the remaining polyimide layer having the openings therein. The positive slope allows the complete filling of the openings.

REFERENCES:
patent: 4247496 (1981-01-01), Kawakami et al.
Koren et al., In GaAsP/InP Under Cut Mesa Laser with Planar Polyimide Passivation, App. Phys. Lett. 42(5), Mar. 1, 1983.
Raffel et al., Laser-Formed Connections Using Polyimide, App. Phys. Lett. 42(8), Apr. 15, 1983.
Andrew et al., Direct Etching of Polymeric Materials Using a Xe Cl Laser, App. Phys. Lett. 43(8), Oct. 15, 1983.
"Effective Deep Ultraviolet Photoetching of Polymethyl Methacrylate by an Excimer Laser", by Y. Kawamura et al., in Appl. Phys. Lett. 40(5) Mar. 1, 1982, pp. 374-375.
"Direct Etching of Resists by U.V. Light" by N. Ueno, et al., Ja. J of App. Phys, vol. 20, No. 10, Oct. 1981, pp. L709-712.

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