Patterning method, patterning apparatus, patterning...

Etching a substrate: processes – Forming or treating mask used for its nonetching function

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C216S027000, C216S041000, C216S049000, C216S056000, C029S025350, C430S313000, C430S314000, C430S315000, C430S316000, C430S317000, C430S320000

Reexamination Certificate

active

10424790

ABSTRACT:
A template1is brought close to or in contact with a surface to be patterned111and patterns are formed with liquid62on the surface111. This method comprises the steps of: bringing the template1close to or essentially in contact with the surface111, supplying liquid62to a plurality of through holes12established in the pattern transfer region10of the template1for supplying the liquid62, and separating the template1from the surface111after the liquid62is adhered to the surface111via the through holes12.

REFERENCES:
patent: 3958255 (1976-05-01), Chiou et al.
patent: 4021276 (1977-05-01), Cho et al.
patent: 4164745 (1979-08-01), Cielo et al.
patent: 4166277 (1979-08-01), Cielo et al.
patent: 5334999 (1994-08-01), Kashiwazaki et al.
patent: 5381166 (1995-01-01), Lam et al.
patent: 5481280 (1996-01-01), Lam et al.
patent: 5639508 (1997-06-01), Okawa et al.
patent: 5868947 (1999-02-01), Sakaguchi et al.
patent: 6057865 (2000-05-01), Hawkins
patent: 6143190 (2000-11-01), Yagi et al.
patent: 6790377 (2004-09-01), Cohen
patent: 2002/0104762 (2002-08-01), Stonas et al.
patent: 2003/0013002 (2003-01-01), Jankowski et al.
patent: 2003/0106487 (2003-06-01), Huang
patent: 0 732 209 (1996-09-01), None
patent: 07117144 (1995-05-01), None
patent: WO 97/33737 (1997-09-01), None
US 2,777,441, 01/1957, Geisler (withdrawn)
Kim, Enoch et al., “Micromolding in Capillaries: Applications in Materials Science”,J. Am. Chem. Soc.,vol. 118, No. 24, 1996, pp. 5722-5731.
Greschner, J. et al., “Process for Image Reversal”,IBM Technical Disclosure Bulletin, vol. 25, No. 6, Nov. 1982, p. 2730.
Hu, Junmin et al., “Using soft lithography to fabricate GaAs/AlGaAs heterostructure field effect transistors”,Appl. Phys. Lett.,vol. 71, No. 14, Oct. 6, 1997, pp. 2020-2022.
Pede, Danilo et al., “Microfabrication of conducting polymer devices by ink-jet stereolithography”,Materials Science&Engineering, vol. C05, 1998, pp. 289-291.
Rogers, John et al., “Nonphotolithographic fabrication of organic transistors with micron feature sizes”,Appl. Phys. Lett.,vol. 72, No. 21, May 25, 1998, pp. 2716-2718.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Patterning method, patterning apparatus, patterning... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Patterning method, patterning apparatus, patterning..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Patterning method, patterning apparatus, patterning... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3852645

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.