Patterning metal layers

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching

Reexamination Certificate

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C257SE21596

Reexamination Certificate

active

07629261

ABSTRACT:
A process for fabricating an electronic device comprising the step of patterning a metallic electrode to the electronic device by laser ablation followed by electroless plating, wherein the process of fabricating the electronic device comprises at least one other laser patterning step over the area of the metallic electrode performed after said step of patterning the metallic electrode.

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Gang Zhao et al: “Selectively Deposited Copper on Laser-Treated Polyimide Using Electroless Plating”; Proceedings of the SPIE - The International Society for Optical Engineering SPIE-INT. Soc. Opt. Eng USA, XP008065774, pp. 505-510, Jun. 7, 2000.
Yang G H et al “Thermal and Electroless Deposition of Copper on Poly (tetrafluoroet hylene-co-hexafluoropropylene) films modified by surface graft copolymerization” IEEE Trans. Adv. Packag.; IEEE Transactions on Advanced Packaging August 2002, vol. 25, No. 3, Aug. 3, 2002 pp. 365-373, XP002386865.

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