Etching a substrate: processes – Adhesive or autogenous bonding of two or more... – Etching improves or promotes adherence of preforms being bonded
Patent
1996-02-14
1998-06-02
Powell, William
Etching a substrate: processes
Adhesive or autogenous bonding of two or more...
Etching improves or promotes adherence of preforms being bonded
216 65, 156250, 1562728, 426107, 426241, B44C 122
Patent
active
057594228
ABSTRACT:
A patterned metal foil/substrate laminate wherein the pattern is formed by laminating a sheet of metal foil to a substrate by applying an adhesive between the metal foil and substrate in a predetermined pattern which defines areas where adhesive is present and areas where no adhesive is present, cutting the metal foil, as by rotary die cutting or laser cutting, in a pattern which corresponds to the boundaries of the adhesive-containing areas and removing the areas of metal foil which are not adhesively adhered to the substrate. Particularly where the laminate is intended for microwave packaging, the laminate further includes a sheet of barrier layer material, preferably polymer film, laminated to the patterned metal foil layer. The polymer film layer-containing laminate can be formed into a container for packaging food intended for heating in a microwave oven, the container having at least one section, corresponding to the areas of the laminate from which metal foil was removed, that is substantially transparent to microwave energy and at least one section, corresponding to the foil-containing areas of the laminate, that is opaque to microwave energy for shielding food adjacent to the opaque section. Preferably, the metal foil is aluminum foil, desirably unannealed aluminum foil, and the substrate is selected from paper, coated or uncoated paperboard and polymer film.
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Habeger Charles C.
Pollart Kenneth A.
Schmelzer Michael A.
Swiontek Anthony Joseph
Fort James Corporation
Leedom Jr. Charles M.
Powell William
Studebaker Donald R.
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