Etching a substrate: processes – Adhesive or autogenous bonding of two or more... – Etching improves or promotes adherence of preforms being bonded
Patent
1997-01-16
1998-09-01
Powell, William
Etching a substrate: processes
Adhesive or autogenous bonding of two or more...
Etching improves or promotes adherence of preforms being bonded
216 65, 216 77, B44C 122, C23F 100
Patent
active
058007245
ABSTRACT:
A method for making a patterned metal foil/substrate laminate by laminating a sheet of metal foil to a substrate by applying an adhesive between the metal foil and substrate and irradiating the metal foil with a laser beam in a predetermined pattern to vaporize the irradiated portions of the metal foil. Particularly where the laminate is intended for microwave packaging applications, the laminate further includes a sheet of barrier layer material, preferably polymer film, laminated to the patterned metal foil layer. The polymer film layer-containing laminate can be formed into a container for packaging food intended for heating in a microwave oven. A particularly effective pattern comprises a plurality of metal foil islands electrically separated by dielectric substrate gaps. Preferably, the metal foil is aluminum foil, desirably unannealed aluminum foil, and the substrate is selected from paper and coated or uncoated paperboard. The patterned metal foil/substrate laminate is also useful for electrical circuitry, particularly, for example, as the resonant circuit in electronic surveillance tags.
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Habeger Charles C.
Pollart Kenneth A.
Fort James Corporation
Leedom Jr. Charles M.
Powell William
Studebaker Donald R.
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