Patterned kill of magnetoresistive layer in bubble domain chip

Details Patterned kill of magnetoresistive layer in bubble domain chip Patterned kill of magnetoresistive layer in bubble domain chip

1979-06-29

1981-12-29

Moffitt, James W.

Static information storage and retrieval

Magnetic bubbles

Detectors

365 36, 365 39, G11C 1908

Patent

active

043085920

ABSTRACT:
A technique and structure is described in which bubble domain devices can be made, and particularly bubble domain devices comprisng contiguous propagation elements. A thin magnetoresistive layer, such as permalloy, is blanket deposited over a substrate including a bubble domain film, and is then selectively "poisoned" to destroy its magnetization except in those areas where thin sensors are to be provided. The poisoned portions of the magnetoresistive layer serve as a plating base for conductor metallurgy which can be used as an ion implantation mask, and for carrying electrical current. This eliminates some process steps which had been required in the prior art, and does not leave magnetic permalloy in those areas of the bubble domain chip were they would adversely affect propagation of domains by ion implanted contiguous propagation elements. This technique can also be used to make bubble domain devices having gapped propagation elements.

REFERENCES:
patent: 3967002 (1976-06-01), Almasi et al.
patent: 4070658 (1978-01-01), Giess et al.
patent: 4164026 (1979-08-01), Almasi et al.
patent: 4164029 (1979-08-01), Keefe
IBM Tech. Disc. Bull.-vol. 21, No. 4, Sep. 1978, pp. 1706-1707.

Affiliated with

Also associated with

Rating

Patterned kill of magnetoresistive layer in bubble domain chip does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Patterned kill of magnetoresistive layer in bubble domain chip, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Patterned kill of magnetoresistive layer in bubble domain chip will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1021139