Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area
Patent
1995-06-26
1996-05-14
Niebling, John
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating selected area
205122, 205135, 205157, 205163, 205165, 205166, 205167, 205169, 205186, 205187, 205205, 205223, C25D 502
Patent
active
055164188
ABSTRACT:
A process for patterned electroplating involves the steps of: (i) coating a substrate with a layer of hydroxyquinoline which acts as an adhesion promoter; (ii) coating the adhesion layer with a radiation sensitive polymeric resist; (iii) imagewise exposing the film to radiation; (iv) developing the image to patternwise expose the substrate; (v) electroplating metal onto the exposed portions of the substrate; and (vi) removing the remaining polymeric film from the substrate.
REFERENCES:
patent: 3523874 (1970-08-01), Dey
patent: 3963590 (1976-06-01), Deyrup
patent: 4279707 (1981-07-01), Anderson et al.
patent: 4652954 (1987-03-01), Church
patent: 4681814 (1987-07-01), Leidheiser, Jr. et al.
patent: 4875124 (1989-10-01), Dickstein et al.
patent: 5055356 (1991-01-01), Minowa et al.
patent: 5143884 (1992-09-01), Skoultchi et al.
patent: 5272026 (1993-12-01), Roland et al.
Nepala, D. A., "Aromatic Azo Compounds as Electrophotographic Sensitizers", IBM Technical Disclosure Bulletin, vol. 11, No. 12, May 1969.
Haines, R. S., "Magnetic Tape", IBM Technical Disclosure Bulletin, vol. 2, No. 4, Dec. 1959.
Lewis, Sr., R. J., Hawley's Condensed Chemical Dictionary, Twelfth Edition, no month, 1993.
Moreau, W. M., "Semiconductor Lithography Principles, Practices and Materials", Plenum Press, New York, 1988. No month.
Mittal, K. L. et al., "Vapor Deposited Adhesion Promoters", IBM Technical Disclosure Bulletin, vol. 17, No. 12, May 1975.
Romankiw, R., et al., "Magnetic Materials, Processes and Devices", Electrochemical Society, Inc., vol. 90-8. No date.
Christenson, T. R., et al., "Micromechanics for Actuators", SPIE vol. 2220, pp. 39-47. No date.
Lochel, B. et al., "Galvanoplated 3D Structures for Micro Systems", Microelectronic Engineering 23 (1994) 455-459, Elsevier. No month.
Gobet, J. et al., "Electrodeposition of 3D Microstructures on Silicon", J. Micromech. Microeng. 3 (1993), 123-130. No month.
Gau, J.-S., "Photolithography for Integrated Thin Film Read/Write Heads", SPIE vol. 1088 Optical/Laser Microlithography II (1989). No month.
Phillips, W. A. et al., "Fluid Control Devices", IEE Colloquium (Digest) n 069 Mar. 15, 1994.
Lochel, B., "Fabrication of Magnetic Microstructures by Using Thick Layer Resists", Microelectronic Engineering 21 (1993) 463-466. No month.
Doss Saad K.
McKean Dennis R.
Renaldo Alfred F.
Wilson Robert J.
International Business Machines - Corporation
Martin Robert B.
Niebling John
Wong Edna
LandOfFree
Patterned electroplating does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Patterned electroplating, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Patterned electroplating will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1893539